Deep-submicron Placement Minimizing Crosstalk
نویسندگان
چکیده
منابع مشابه
Deep - submicron Placement Minimizing
Placement of multiple dies on an MCM or high-performance VLSI substrate is a non-trivial task in which multiple criteria need to be considered simultaneously to obtain a true multi-objective optimization. Unfortunately, the exact physical attributes of a design are not known in the placement step until the entire design process is carried out. When the performance issues are considered, crossta...
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Placement of multiple dies on an MCM or high-performance VLSI substrate is a non-trivial task in which multiple criteria need to be considered simultaneously to obtain a true multi-objective optimization. Unfortunately, the exact physical attributes of a design are not known in the placement step until the entire design process is carried out. When the performance issues are considered, crossta...
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ژورنال
عنوان ژورنال: VLSI Design
سال: 2001
ISSN: 1065-514X,1563-5171
DOI: 10.1155/2001/46394